Floor panel

ABSTRACT

A floor panel includes a substrate and a top layer provided on the substrate. The top layer is composed of a print and a transparent thermoplastic layer having a thickness of 0.5 mm or less and is situated above the print. The floor panel, at least on two opposite edges, is provided with a straight or curved chamfer extending to below the global level of the print.

This application claims the benefit under 35 U.S.C. 119(e) to the U.S.provisional applications No. 61/426,734 filed on Dec. 23, 2010, and No.61/429,845 filed on Jan. 5, 2011.

BACKGROUND

1. Field of the Disclosure

This invention relates to floor panels.

More particularly, this invention relates to floor panels of the typewhich is at least composed of a substrate and a top layer provided onthis substrate, wherein said top layer comprises a print. As known,above such motif a transparent or translucent synthetic material layermay be provided, which then forms part of said top layer.

In particular, the present invention relates to panels of the typewhich, at two or more opposite edges, comprises coupling means orcoupling parts, with which two of such floor panels can be coupled atthe respective edges, such that they are locked to each other in ahorizontal direction perpendicular to the respective edge and as in theplane of the floor panels, as well as in a vertical directionperpendicular to the plane of the floor panels. Such floor panels can beapplied for composing a so-called floating floor covering, wherein thefloor panels are connected to each other at their edges, however, liefreely on the underlying surface.

2. Related Art

From WO 97/47834, laminate floor panels are known for forming a floatingfloor covering. However, laminate floor panels have the disadvantagethat they mostly are provided with a moisture-sensitive substrate,namely, MDF or HDF (Medium Density Fiberboard or High DensityFiberboard), and that the top layer provided on this substrate, when thefloor covering is in use, leads to the occurrence of ticking noises. Thetop layer, to wit, is composed of thermo-hardening resin and leads tothe development of a very hard surface layer. The substrate, too, ishard due to the high density of MDF or HDF. On average, laminate floorpanels have a thickness situated between 6 and 12 millimeters, whereinthe thickness of the top layer mostly is less than 0.5 millimeters.

From EP 1 938 963 and WO 2010/023042, vinyl-based floor panels are knownfor forming such floating floor covering. Such vinyl-based floor panelsmostly have a thickness of 3 to 5 millimeters and have a high materialdensity. Above the print, a transparent thermoplastic layer and possiblya superficial lacquer layer are provided. The thermoplastic layer mostlyhas a thickness of 1 millimeter or more. Such layer, on the one hand,provides wear resistance to the floor panel, and, on the other hand,allows forming a relief on the surface. So, for example, a chamfer canbe realized in this transparent layer, such as in the aforementioned WO2010/023042, or impressions for imitating wood pores can be provided.Nevertheless, the floor panels of the state of the art still do give aplastic-like impression. The thick thermoplastic layer may lead to areduced view on the print, by a lack of transparency. Inherent to thesefloor panels is also their limited bending stiffness and their highdeformability. These features lead to problems when the floor panels areprovided on an uneven underlying surface. Namely, after a certain periodof time, the unevennesses of the underlying surface may migrate towardsthe surface of the floor covering. With a local load, for example,underneath the legs of tables or chairs, permanent impressions will becreated, which also are undesired.

From WO 2007/081267 and US 2004/146695, floor panels are known with asubstrate and a top layer provided thereon, wherein the top layer iscomposed of a print and a thick and soft transparent layer situatedabove this print. At one edge, the floor panel has a lowered edge regionin the form of a groove with a horizontal bottom. Possibly, the bottomof this groove can extend on a level situated below the global level ofthe print. Possibly, the bottom of the groove can be performed colored.This technique is suitable for imitating cement joints or other tilejoints, however, leaves much to be desired when it should be appliedwith floor panels representing a print with a wood pattern.

Floor panels with a relatively thick soft top layer, for example, athermoplastic top layer, further have the disadvantage that they can bepushed upward at the edge, for example, in that the floor panels aretensioned against each other or in that, when the floor covering isbeing walked on, a frictional contact is created between the shoe andthe edge of the top layer. This may result in an accelerated wear onthese edges and/or to possibly unsafe situations. Up to now, it wasthought that a thick transparent top layer was necessary forwithstanding such wear.

SUMMARY

The present invention relates to an alternative panel, which in firstinstance is intended as a floor panel for forming a floating floorcovering. According to various preferred embodiments of the invention,also a solution is offered for one or more problems with the floorpanels of the state of the art.

To this aim, the invention, according to its first independent aspect,relates to a floor panel, wherein said floor panel comprises a substrateand a top layer provided on this substrate, wherein the top layer is atleast composed of a print and a transparent thermoplastic layer situatedabove this print, wherein this floor panel, at least at two oppositeedges, is provided with a straight or curved chamfer, with thecharacteristic that said transparent thermoplastic layer preferably hasa thickness of 1 millimeter or less, or even of 0.5 millimeters or less,and that said chamfer extends to below the global level of said print.

The inventor has perceived that the thickness of the thermoplastic toplayer could be limited and still an acceptable wear resistance could beobtained by means of a relatively deep chamfer. Possible upward-pushedportions of the top layer then are situated underneath the floorcovering, such that no excessive signs of wear will occur. As a chamferis applied, an impact or friction of the shoe on the edge of the uppersurface largely will be avoided, such that also on the new upper edge ofthe floor panel the risk of accelerated wear is minimized. Moreover, asolution is offered for the plastic-like appearance of the floor panelsfrom the state of the art. By combining a print located close to thesurface, preferably less than 0.5 millimeters, with a deep chamfer,preferably deeper than 0.5 millimeters, an exceptional depth effect iscreated. Problems with the transparency of the thermoplastic layer areavoided to a large extent by limiting its thickness.

According to the most preferred embodiment, said thermoplastic top layerhas a thickness of 0.3 millimeters or less.

Said substrate preferably is realized from a material which is harderthan said thermoplastic transparent layer. By means of the thermoplasticsynthetic material near to or on the surface of the floor panel, asolution is offered for the occurrence of excessive ticking noises. As aharder substrate is chosen, a good composition is obtained, whereinpermanent impressions can be minimized. Moreover, said substrate avoidsthe lining out or migrating of unevennesses on the underlying surfacetowards said top layer.

Said chamfer can be realized in any manner. Below, some possibilitiesfor the realization thereof are explained.

According to a first possibility, the chamfer is formed by removing amaterial part of the top layer on the respective edge. Preferably, theremoved material part extends through the transparent thermoplastic toplayer and the print into an underlying layer and/or into the substrate.According to this first possibility, the print is omitted on at least aportion of the obtained chamfer.

According to a second possibility, the chamfer is formed by locallypressing down a material part of the top layer at the respective edge.By facilitating such pressing down, an underlying layer and/or thesubstrate may or may not be pre-formed or provided with an incision,which at least partially offers room for the pressed-down material part.Preferably, the print, in this second possibility, extendsuninterruptedly from on the actual surface of the floor panel over theentire or approximately entire surface of the chamfer.

Preferably, such chamfer is provided with a separate decorative layer.Such embodiment is particularly interesting in combination with saidfirst possibility, but is also not excluded in combination with saidsecond possibility. Preferably, said separate decorative layer comprisesa lacquer layer or a transfer print layer or an otherwise obtained printlayer, such as a print layer obtained by means of a digital printingprocess, such as inkjet printing. In the case of a printing process,preferably UV-based inks are used. The inventor has found that theseinks will adhere best to thermoplastic underlying layers. In the case oftransfer printing, preferably heated transfer is applied, for example,in that the transfer element, for example, a transfer roller, is heated.In such manner, a good adherence to an underlying thermoplastic layercan be obtained.

As already mentioned, it is possible that in the floor panel of theinvention, the chamfer extends through said print. This embodiment isparticularly interesting with said first possibility for realizingchamfers.

Preferably, the top layer of the floor panel of the invention furtheralso comprises a back layer, which is situated between said print andthe substrate. Said back layer preferably also comprises thermoplasticmaterial, and preferably a filler material, too. This may relate, forexample, to a layer of PVC (Polyvinyl chloride), filled with chalk.Preferably, so-called soft PVC is applied, which is produced by means ofplasticizers.

For the transparent thermoplastic layer, a PVC-based layer can beapplied. Alternatives are, for example, PVdC (PolyVinyldiChloride)-based, PU (PolyUrethane)-based or PP (PolyPropylene)-basedlayers. As mentioned above, the thermoplastic layer according to theinvention preferably has a limited thickness. Good values for thethickness of the transparent thermoplastic layer are situated, forexample, between 0.15 and 0.4 millimeters. Preferably, the transparentthermoplastic layer is free from solid additives, such as ceramicparticles for promoting the wear resistance, although this kind ofparticles as such is not excluded. However, the inventor has found thatthey can be omitted, with the intention of obtaining good transparency,whereas still an acceptable wear resistance is maintained, namely, awear resistance comparable to or better than that of a laminate panel ofthe AC2- or AC3-class, as measured according to EN 13329.

As already mentioned, a lacquer layer can be applied as the top layer ofthe floor panel. Herein, this may relate to a UV- or an electronbeam-hardening lacquer layer or to a PU lacquer layer. Preferably, thislacquer layer extends uninterruptedly over the chamfer. This can berealized most simply in combination with the above-mentioned secondpossibility and is not excluded in combination with the above-mentionedfirst possibility. Preferably, said lacquer layer is omitted on thesurface of a chamfer realized by means of the above-mentioned firstpossibility.

Said print preferably is provided on a carrier sheet, wherein thecarrier sheet, together with the print, forms a printed synthetic film.As synthetic film, preferably a PVC-, PU- or PP-based film is used. Theprint preferably is performed with solvent inks or with water-basedinks. Preferably, in the final floor panel, the carrier sheet is locatedunderneath the print. However, it is not excluded that the print couldbe situated on the underside of the carrier sheet, wherein then use ismade of a transparent carrier sheet, which then effectively forms partof the transparent thermoplastic layer, which as a whole preferablymeets the preferred thickness of the present invention.

The whole of the top layer, namely, the print including the possiblecarrier, the transparent top layer and the possible back layer,preferably consist of an annealed or relaxed thermoplastic layer. Thecommon thickness of the composing layers of the top layers preferably isbetween 0.5 and 3 millimeters, or still better between 1 and 2millimeters.

The top layer preferably is assembled prior to connecting it to thesubstrate. The connection to the substrate can be performed, forexample, by means of a glue layer, for example, by means of dispersionglue based on polyurethane. It is not excluded that the top layer isassembled partially or entirely simultaneously with the connection tothe substrate. According to another possibility thereof, for example, atleast the top layer and/or the backing layer partially can be providedas a liquid or paste-like substance on the substrate, where they arehardened.

The substrate preferably comprises a board material having a density ofmore than 450 kilograms per cubic meter, or even of more than 650kilograms per cubic meter. Preferably, said substrate substantiallyconsists of a wood-based material, such as MDF or HDF (Medium or HighDensity Fiberboard), or for the substrate use is made of another boardmaterial on the basis of glued-together wood particles or wood fibers.Such substrate provides for that relatively stiff or rigid panels areobtained, which can be gluelessly installed in a smooth manner.

Preferably, the substrate has a thickness of 2 to 10 millimeters. Theentire floor panel preferably has a thickness situated between 5 and 15millimeters. Preferably, the substrate forms at least half of thethickness of the floor panel.

On the lower side of the substrate, a backing layer or sublayer,preferably a vapor-tight layer, can be provided. Such backing layer orsublayer preferably consists of a thermoplastic synthetic material layerand/or of a hot-melt glue. The backing layer preferably has a thicknesscorresponding to the thickness of the top layer, including a possibleback layer, however, preferably is made thinner.

In the cases where a back layer or other intermediate layer is appliedbetween the print and the substrate, two floor panels, in an installedcondition of two of such floor panels, preferably have a contact surfaceformed on the respective back layers or intermediate layers, whereinthis contact surface extends underneath the deepest point of therespective chamfers. Such contact can form a first barrier againstmoisture which would penetrate into the seam or joint between two floorpanels. Said back layers or intermediate layers preferably comprise acompressed portion at the location of the contact surface.

Preferably, the invention is applied with floor panels which, at therespective edges, are provided with mechanical coupling means allowingthat two of such floor panels can be coupled to each other, such that alocking is obtained in a vertical direction perpendicular to the planeof the coupled panels, as well as in a horizontal directionperpendicular to the coupled edge and in the plane of the panels.Preferably, the coupling means also show one or a combination of two ormore of the following features:

-   -   the feature that the mechanical coupling means or coupling parts        substantially are realized as a tongue and a groove bordered by        an upper lip and a lower lip, wherein this tongue and groove        substantially are responsible for the locking in said vertical        direction, and wherein the tongue and groove are provided with        additional locking parts, substantially responsible for the        locking in said horizontal direction. Preferably, the locking        parts comprise a protrusion on the lower side of the tongue and        a recess in the lower groove lip. Such coupling means and        locking parts are known, for example, from WO 97/47834;    -   the feature that the mechanical coupling means or coupling parts        press the coupled floor panels against each other, for example,        in that these mechanical coupling means are realized with a        so-called pretension, as is known as such from EP 1 026 341. The        tensioning force with which the floor panels are pressed against        each other or towards each other, can be obtained, for example,        in combination with the above feature, by means of a lower lip,        which is bent out in coupled position, which, in an attempt of        springing back, presses against the lower side of the tongue.        The invention is particularly interesting for being applied with        such floor panels, as there the risk is increased that the        thermoplastic layer is pushed upward at the edges as an effect        of the tensioning force. Preferably, here the aforementioned        preferred embodiment is used, wherein underneath the chamfer a        contact surface is formed on an intermediate layer or back        layer. The tensioning force, together with a possible        compression at the location of the contact surface, leads to a        good resistance against moisture penetration;    -   the feature that the mechanical coupling means allow a coupling        by means of a horizontal, or quasi-horizontal, shifting movement        of the panels towards each other. With this type of panels,        there is a risk of the thermoplastic layer being pushed upward        near the panel edges, to wit at the end of the coupling        movement, when the edges would bump against each other. By        applying the invention, this risk is reduced;    -   the feature that the mechanical coupling means allow a coupling        by means of a turning movement W along the respective edges.        With this type of panels, there is a risk of the thermoplastic        layer being pushed upward near the panel edges during the        coupling movement, when the edges should turn against each        other. By applying the invention, this risk is reduced;    -   the feature that the mechanical coupling means allow a coupling        by means of a downward-directed movement of a male coupling part        having, for example, a tongue, into a female coupling part        having, for example, a groove. With this type of panels, there        is a risk of pushing up the thermoplastic layer near the panel        edges during the coupling movement, when the edges would chafe        along each other. By applying the invention, this risk is        reduced;    -   the feature that the mechanical coupling means, or at least the        pertaining upper edge, is realized by means of a milling        treatment with rotating milling tools. The use of milling tools        can lead to the occurrence of pushed-up edges already during        manufacture of the floor panels. By applying the invention, this        risk is reduced.

Preferably, said coupling means substantially are realized in saidsubstrate. Preferably, said coupling means are provided by means of amilling treatment with rotating milling tools. Preferably, the floorpanel of the invention relates to a rectangular, either oblong orsquare, panel, which is provided with mechanical coupling means on bothpairs of opposite edges.

Preferably, the chamfers on both opposite edges are made identical orapproximately identical.

The chamfer which is applied according to the invention, preferably,globally seen, has an angle of 35 to 55° with the panel surface, whereinan angle of approximately 45° is optimum. Smaller angles than 35° leadto wide edges, whereas larger angles are disadvantageous in that theyhave a higher risk of being pushed up when the floor is being walked on.

Preferably, the chamfers, in a coupled condition of two floor panelswith the characteristics of the invention, form a V-groove, wherein thewidth of the possible bottom of this V-groove is less than one fifth andstill better less than one seventh of the width of the opening of theV-groove at the upper surface of the coupled panels.

Preferably, the chamfers, in a coupled condition of two floor panelswith the characteristics of the invention, form a V-groove, wherein thewidth of the possible bottom of this V-groove is smaller than the depthof the respective V-groove. Preferably, the width of the possible bottomis less than half of the depth of the respective V-groove.

The herein above-mentioned characteristic preferred embodiments of thechamfers or V-grooves of the invention, each individually, however,preferably in combination, are ideal for being applied with printsrepresenting a wood pattern.

Preferably, the floor panel of the invention further is characterized inthat said floor panel is made rectangular and oblong and that saidchamfer is at least or exclusively provided on the long pair of oppositeedges. Of course, such chamfer can be provided also or only on the shortpair of opposite edges.

According to a particular embodiment, said chamfer, seen incross-sections transverse to the respective edge, has a geometry varyingalong the respective edge. Preferably, this chamfer, over the major partof the length of the respective edge, or over the entire length thereof,has the inventive feature that this chamfer extends to below the globallevel of the print. The varying geometry preferably comprises at least avariation of the global angle over which the chamfer extends.

According to another particular embodiment, said substrate is madewaterproof at least at the respective edge, or at least measures havebeen taken at the respective edge for obtaining an increased resistanceagainst moisture or moisture penetration in the substrate. This can berealized in different possible manners, for example, in that thesubstrate as such is waterproof, in that the substrate, at therespective edge, is provided with a covering by means of awater-repellent substance, or in that the substrate comprises asynthetic edge portion at the respective edge.

According to a second independent aspect, the present invention relatesto a floor panel which can offer, amongst others, installationadvantages. To this aim, the invention, according to its secondindependent aspect, also relates to a floor panel, wherein this floorpanel is made rectangular and oblong and comprises a substrate and a toplayer provided on this substrate, wherein the top layer is composed atleast of a print and a transparent thermoplastic layer situated abovethis print, with the characteristic that the floor panel has a length ofmore than 180 centimeters and wherein the floor panel preferably furthercomprises means for limiting the bending by its own weight. As longerfloor panels are used, a surface can be installed with less operations.The means which limit the bending allow improving the installationadvantage even more. Namely, by the reduced bending, it is simpler tomarket and/or install the panels, certainly in the case when use is madeof panels which, at least at one pair of opposite edges, are providedwith mechanical coupling means, which, for installation, must beprovided in each other. Preferably, finally a bending is obtained ofless than 50 centimeters per meter, or even of less than 25 or less than10 centimeters per meter.

The means which limit the bending can comprise one or a combination oftwo or more of the following measures:

-   -   the measure wherein at least one layer of the floor panel has a        density of more than 650 kilograms per cubic meter, or even of        more than 750 kilograms per cubic meter;    -   the measure wherein the floor panel has a thickness of 5        millimeters or more;    -   the measure wherein the floor panel comprises at least one        embedded glass fiber layer, wherein this glass fiber layer is        situated outside of the neutral fiber;    -   the measure wherein the floor panel comprises at least one        embedded profile, wherein this profile globally extends in the        longitudinal direction of the floor panel and wherein this        profile, in the case that coupling parts in the form of a tongue        and groove are provided, preferably is situated closer to the        tongue than to the groove.

Preferably, the print of the floor panel shows a wood pattern, whichpreferably extends with the pore direction in the longitudinal directionof the floor panel. Preferably, the wood pattern, at least in thelongitudinal direction and preferably also in the width direction of thefloor panel, is free from repetitions.

Preferably, here this relates to a print provided on a carrier sheet,for example, a printed synthetic material film. Such synthetic materialfilm can consist substantially of PVC (Polyvinyl chloride), PU(Polyurethane) or PP (Polypropylene).

The print preferably is applied by means of an offset printing processon said carrier sheet or possibly direct on the underlying substrate orthe possible back layer. However, it is not excluded that a digitalprint might be applied, for example, by means of an inkjet printingdevice. As inks, preferably UV-based or solvent-based inks are applied.It is not excluded that water-based inks might be applied. Preferably,an ink on the basis of pigments is applied. Preferably, printing isperformed on a web or roll of such synthetic film, back layer or on alarger board of the underlying substrate material, wherein said poredirection preferably extends transverse to this web. So, with offsetprinting or other printing processes in which printing cylinders areapplied, a motif can be obtained without repetitions in the longitudinaldirection of the floor panel, even with floor panels having a length of1.8 meters or more.

The use of fast-drying inks, such as inks on the basis of pigment,enable such technique, also in offset printing, for printing on anunderlying synthetic material layer, such as on the synthetic materialfilm, the back layer, or an underlying substrate on the basis ofsynthetic material. In particular, UV- or solvent-based inks are suitedfor this purpose. At least with the use of water-based inks, preferablyafter each printing cylinder or print head, in the case of digitaltechniques, an appropriate drying technique is applied. With suchtransversely printed wood patterns on an underlying synthetic materiallayer, fast drying is of importance for obtaining a good resolution, forexample, a resolution of more than 250 dots per inch, or still better ofmore than 500 dots per inch.

It is clear that such printed web of synthetic film, back layer orprinted larger board of substrate material can be applied formanufacturing a plurality of floor panels, by subdividing the respectivelayers or boards.

Preferably, the floor panel has a relief on its surface, which is madecorresponding to said print, such that a so-called embossed-in-registerstructure is obtained.

It is evident that in the floor panel of the second aspect, thematerials and composition of the first aspect can be applied for thesubstrate, the top layer, the print, the back layer and/or theunderlying layer, without herein necessarily applying a chamfer. Also,the coupling means and locking parts mentioned there can be applied. Ofcourse, it is not excluded to combine a chamfer according to the firstaspect with a floor panel showing the characteristics of the secondaspect.

According to all aspects, it is possible that the substratesubstantially consists of a thermoplastic material. So, for example, avinyl-based substrate, such as PVC, a polyethylene-based substrate, apolypropylene-based substrate or a polyurethane-based substrate can beapplied. These materials have a good resistance against water ormoisture and are readily available. Preferably, the substratesubstantially consists of a foamed synthetic material board. Preferably,in that case synthetic material of the closed-cell type is concerned. Byfoaming, by means of an amount of synthetic material comparable to thatof the floor panels of EP 1 938 963, a thicker and stiffer substrate isobtained, such that the risk of the occurrence of migration effects fromthe underlying layer to the surface of the floor covering can beminimized.

It is not excluded that soft PVC could be applied for the substrate 6.To those skilled in the art, soft PVC is known as a material which isobtained on the basis of PVC and plasticizers and which has a density ofless than 1.35 grams per cubic meter.

Preferably, the transparent thermoplastic layer mentioned in the variousaspects substantially consists of PVC and/or plasticizer. Preferably,for the manufacture of this layer, use is made of a paste containing apercentage of plasticizer situated between 5 and 75 percent by weight.Preferably, said transparent or translucent layer has a Shore A hardnesssituated between 50 and 100.

It is clear that, where “hardness” is mentioned, the hardness isintended of the surface of the respective layer, substrate, or othermaterial, measured on a flat side thereof, namely, the side thereofwhich is directed upward in the final floor panel, or the side which isrelevant for the occurrence or non-occurrence of permanent impressions.

According to all aspects, the present invention preferably relates tofloor panels or other panels which as such are rigid and thus can not bewound up. Preferably, the final panel shows a thickness of more than 5millimeters, however, preferably of less than 15 millimeters. A goodvalue for the thickness is 7 to 10 millimeters. Such panels are verysuitable for providing mechanical coupling means thereon, which allow toconnect two or more such panels to each other at their edges. It isclear that also the possible larger boards, from which a plurality ofsuch floor panels are formed, and the substrates as such are rigid.Preferably, the floor panels, boards and substrates are so rigid thatthey will bend less than 10 centimeters per meter under their ownweight.

According to all aspects, the floor panels preferably have a width of 8centimeters or more. Particularly preferred dimensions are a widthsituated between 14 and 22 centimeters and a length situated between 118and 220 centimeters.

It is clear that according to the invention, by “substrate” an internallayer of the floor panel itself is meant, which as such can be madesingle- or multi-layered, however, wherein the respective layer orlayers preferably have an overall thickness which is larger than half ofthe thickness of the entire respective panel and/or wherein therespective layer or layers have an overall weight which preferably ishigher than half of the weight of the entire respective panel.Preferably, the contour of the respective coupling parts issubstantially or entirely realized in the substrate.

Preferably, the possible intermediate layer or back layer extends abovethe horizontal level determined by a center line of the floor panel, andstill better above the center line of the possible coupling parts, suchas above the center line determined by the tongue-in-groove coupling.Preferably, the possible intermediate layer or back layer extends abovethe coupling parts which for the major part are responsible for thevertical locking. These coupling parts namely are preferably realized inthe substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

With the intention of better showing the characteristics of theinvention, hereafter, as an example without any limitative character,some preferred embodiments are described, with reference to theaccompanying drawings, wherein:

FIG. 1 represents a panel, more particularly a floor panel, with thecharacteristics of, amongst others, the first aspect of the invention;

FIG. 2 in cross-section represents a view according to the line II-IIrepresented in FIG. 1;

FIG. 3, at a larger scale, represents a view on the area indicated by F3in FIG. 2;

FIG. 4 in cross-section represents a view according to the line IV-IVrepresented in FIG. 1;

FIG. 5, in a view similar to that of FIG. 3, represents a variant;

FIG. 6 in perspective represents a possible manner of coupling floorpanels having the characteristics of the invention;

FIGS. 7 to 10 represent various possibilities for realizing a chamfer ina view on the area indicated by F7 in FIG. 2;

FIGS. 11 and 12, in a view similar to that of FIGS. 3 and 5, representstill more variants;

FIGS. 13 and 14, in a view similar to that of the right-hand part ofFIG. 4, represent another possibility for realizing a floor panel havingthe characteristics of the invention;

FIG. 15 illustrates a method having the characteristics of a thirdaspect of the invention, which will be described in more detail below;

FIG. 16 represents a floor panel having the characteristics of thesecond aspect of the invention mentioned in the introduction;

FIG. 17 represents a cross-section according to the line XVII-XVIIrepresented in FIG. 16;

FIG. 18 represents a cross-section according to the line XVIII-XVIIIrepresented in FIG. 17;

FIGS. 19 and 20, in a view similar to that of the left-hand part of FIG.17, represent variants.

DETAILED DESCRIPTION OF VARIOUS EMBODIMENTS

FIG. 1 represents a floor panel 1 with the characteristics of, amongstothers, the first aspect of the invention. In this case, this relates toa rectangular and oblong floor panel 1 with a pair of long sides oredges 2-3 and a pair of short sides or edges 4-5.

FIG. 2 represents that the floor panel 1 is of the type which comprisesat least a substrate 6 and a top layer 7 provided thereon. In theexample, the top layer 7 has a thickness T of at least 0.5 millimeters.Here, specifically an annealed thermoplastic top layer is concerned,which substantially consists of PVC.

FIG. 3 shows that the thermoplastic top layer 7 preferably as such iscomposed of a back layer 8, a provided thereon motif 9 and a transparentthermoplastic layer or wear layer 10. Herein, the back layer 8preferably covers a thickness T1 of more than 45 percent of the overallthickness T of the top layer 7. In this case, the back layer 8 consistsof a layer of soft recycled PVC, which is filled with chalk. In thiscase, the back layer 8 as such has a higher density than saidtransparent or translucent layer 10. In this case, the motif 9 isprovided on a carrier 11. In this case, this relates to a printed PVCfilm. For the transparent thermoplastic layer or wear layer 10,preferably a PVC layer with a thickness T2 of minimum 0.2 millimeters isapplied. Preferably, the PVC layer is not thicker than 0.5 millimeters.The inventors have found that a thickness T2 of 0.15 to 0.4 millimeterseffects a good war resistance, even when it should be substantially freefrom solid additives, such as ceramic particles, for example, aluminumoxide particles, which as such would effect an increase of the wearresistance. The overall thickness T of said top layer 7 preferably isbetween 0.5 and 3 millimeters, wherein a thickness T of 1 to 2millimeters is desirable. In the cases where no use is made of a backlayer 8, the overall thickness of the top layer 7 of course may bethinner, for example, a thickness situated between 0.2 and 1 millimeter,for example, a thickness of approximately 0.5 millimeters.

For the substrate 6 of the floor panel 1 of FIG. 1, use is made of asubstrate 6, which comprises wood particles, in this case, wood fibers,bonded with a binding agent, such as MDF or HDF. Preferably, the appliedsubstrate material has a residual moisture content of less than 10percent by weight. Instead of MDF or HDF, also a substrate having a lowdensity can be chosen, for example, of less than 600 kilograms per cubicmeter. This may relate, for example, to a wood-based material whichcomprises wood fibers, which are obtained from recycled wood and whichalso are bonded with a binding agent. Also, a wood particle board may beopted for.

At the lower side of the substrate 6, there is an underlying layer 12 orbacking layer. In this case, the backing layer comprises thermoplasticsynthetic material. Preferably, for the backing layer or underlyinglayer 12, PVC, preferably recycled PVC, is applied, filled with chalk orhot-melt glue. In principle, for the backing layer or underlying layer12, a similar composition can be applied as for the back layer 8situated in the top layer 7. Of course, also another, preferablyvapor-tight layer can be chosen, certainly in the cases in which no backlayer 8 is present, or in the cases where use is made of an annealed orrelaxed thermoplastic top layer. Such vapor-tight backing layer orunderlying layer can consist, for example, of a substance applied inliquid condition, which hardens on the lower side of the substrate, forexample, a vinyl-based substance or a hot-melt glue, which thenpreferably is based on polyurethane.

The substrate 6 preferably is made pigmented in a color corresponding tothe color of said back layer 8, for example, both the substrate 6 andthe back layer 8 in black, or both in white.

The floor panel 1 from FIGS. 1 to 4 shows an edge portion 13 ofsynthetic material on at least one edge 4, in this case on both oppositeedges of the short pair of sides 4-5, wherein said synthetic material isdifferent from the substrate material 6. This synthetic materialconcerns a measure for obtaining an increased resistance againstmoisture or moisture penetration in the substrate material 6. In thiscase, the synthetic material extends at least over 80 percent of thethickness T3 of the substrate. The attachment of the edge portion 13 tothe substrate material 6 is obtained by hardening said syntheticmaterial on the respective portion of the substrate material 6. In thiscase, by the hardening of the synthetic material, also an adherence isobtained to the lower side of the top layer 7 and to the lateral edges14 of the backing layer 12. This latter is not necessarily the case. So,for example, either the top layer 7 or the backing layer 12 can be gluedagainst the upper side or lower side, respectively, of the edge portion13.

FIG. 2 represents that the connection between the edge portion 13 andthe substrate material 6 extends over a boundary surface 15, whichcomprises partial surfaces 16 extending transverse to the normal of thesurface 17 of the panel 1. In this case, the respective partial surfaces16 respectively extend approximately horizontal. However, this is notnecessarily so, and inclined partial surfaces and/or curved boundarysurfaces can be used.

The example also illustrates that the respective edges 4-5 of thesubstrate material 6 can be formed exclusively from said edge portion13. In those cases, an appropriate complete protection of the substratematerial 6 is obtained on the respective edges 4-5.

For the synthetic material of the edge portions 13, use is made of amaterial obtained on the basis of a two-component system. Preferably, apolyurethane is applied, obtained on the basis of the components polyoland isocyanate. By means of this material, a chemical bond to the woodparticles of the substrate 6 can be obtained. Moreover, the polyurethanepreferably has the features of a thermo-hardening polymer.

FIG. 2 represents that the respective edges 4-5 are made with a profileand that this profile comprises coupling means 18, with which this panel1 can be coupled to other similar panels 1, as represented in dashedline 19. In the coupled condition, not represented here, a locking iseffected in a horizontal direction H1 perpendicular to the edge and inthe plane of the panel 1, as well as in a vertical direction V1perpendicular to the plane. The coupling means 18 represented heresubstantially are made as a tongue 20 and a groove 21, bordered by alower lip 22 and an upper lip 23. For obtaining the locking inhorizontal direction H1, the tongue 20 and groove 21 are provided withcooperating locking parts 24-25, in this case in the form of aprotrusion 24 on the lower side of the tongue 20 and a recess 25 in thelower groove lip 23. In this case, the tongue profile can be introducedinto the groove 21 at least by means of a turning movement W along therespective edge for obtaining the coupled condition. Preferably, thecoupling means 18 also allow other coupling movements, such as acoupling by means of a substantially horizontal shifting movement of thepanels 1 towards each other.

It is clear that also on the long sides 2-3 of the floor panel 1, usecan be made of edge portions 13, as illustrated by means of FIG. 2.

FIG. 4 represents that on the other pair of opposite edges 2-3, in thiscase on the long sides 2-3 of the floor panel 1, other measures areperformed for obtaining an increased resistance against moisture ormoisture penetration in the substrate thereof. The substrate has aprofile 26 on the respective edges 2-3, and on this profile 26, amoisture-repellent or sealing covering layer 27 is applied, in this casea hot-melt glue, which can be based, for example, on polyurethane.

In the example, this covering 27 extends along the long sides 2-3 of thefloor panel 1 at least over the entire distance between the edgeportions 13 of the short pair of edges 2-3. Herein, this relates to acovering 27, which has been applied calibrated at least on a portion ofthe profiled edge region or profile 26, such that the present thereoncoupling means 18 and locking parts 24-25 are not or almost not hinderedwhen performing the coupling movement.

A particularity of the covering layer 27 represented here is that itextends over the profile 26 up to a lateral surface 28 of said top layer7. This is illustrated lucidly by means of FIG. 5. Moreover, thecovering layer, at least on one of the long edges, in this case on bothlong edges 2-3, is provided in an undercut 29 performed in said lateralsurface 28. By means of this measure, it is effected that in coupledcondition a gap of less than 0.2 millimeters is obtained between theupper edges 30 of the panels 1, and in this case even no gap.

The covering 27 maximally extends to a point 31 at a distance from theupper edge 30 or decorative side 17 of the respective panel 1. At thispoint 31, the covering 27 is countersunk at least partially, in thiscase even completely, in said recess 29.

Generally, the point 31 preferably is situated in said recess 29provided in the lateral surface 28 of the top layer 7. Preferably, saidrecess extends substantially or even entirely underneath the motif 9 ofthe top layer 7, such as it is the case here.

In the example of FIG. 4, the covering 27 is applied at least calibratedon a portion of the profiled edge region or the profile 26, which, in acoupled condition of two such panels 1, forms a contact surface32-33-34-35. In the present case, this is provided at least calibratedon the contact surfaces 32-33 responsible for the vertical locking V1and on the contact surfaces 34-35 responsible for the horizontal lockingH1.

According to the example of FIG. 4, on the long pair of opposite edges2-3 similar coupling means 18 are applied as on the short pair ofopposite edges 4-5, in that they also allow a coupling at least by meansof a turning movement W along the respective edges. However, this is notnecessarily so, and it is possible that coupling by turning is onlypossible on the long pair of edges 2-3, whereas the short pair of edges4-5, for example, allows at least a coupling by means of a substantiallyhorizontal or downward coupling movement N of the respective edges 4-5towards each other. Such embodiment is represented on FIG. 6.

The floor panel 1 of FIG. 6 is provided, on the short pair of edges 4-5,with coupling means 18, which allow a coupling by means of a downwardmovement N of the coupling means on the one edge 4 in the coupling meanson the other edge 5. Herein, the coupling means 18 are realized as amale coupling part 36 and a female coupling part 37, wherein the malecoupling part 36 can be provided in the female coupling part 37 by meansof said downward movement N.

FIG. 6 illustrates how these panels 1 can be coupled, wherein thesepanels 1, on the long sides 2-3, are provided with coupling means 18,which allow at least a coupling by means of a turning movement W, and,on the short sides 4-5, are provided with coupling means 18, which allowat least a coupling by means of a downward movement N. As represented,they can be engaged into each other by means of a single fold-downmovement N, wherein the long sides 2-3 are turned into each other andautomatically a downward coupling movement N is created on the shortsides 4-5. With the turning on the long sides 2-3, as well as with theautomatic downward movement N on the short pair of edges, there may be acontact between the upper edges 30 of the floor panels, by which abulging of the thermoplastic material of the wear layer 10 can occur atthe location of these upper edges 30. The present invention can minimizethe risk of the occurrence of such bulging edges.

The particularity of the present invention according to its first aspectis that, as clearly illustrated by means of FIGS. 1 to 5, the floorpanel 1, at least at two opposite edges 2-3, is provided with a chamfer38, in this case a straight chamfer. In the examples, this chamfer 38 iscombined with a relatively thin transparent thermoplastic layer or wearlayer 10, which, for example, has a thickness T2 of approximately 0.3millimeters. Herein, the chamfer 38 extends to below the global level N1of the print 9 and preferably to below the global level N2 of theprinted film or the carrier 11. In the represented cases, this each timerelates to a chamfer 38 realized by means of the first possibilitytherefor mentioned in the introduction. Hereby, the print 9 is omittedon a portion of the surface of the chamfer 38. The represented chamfers38-38A form an angle A of approximately 45° with the panel surface orthe decorative side 17. In a coupled condition of two of such floorpanels 1, as represented here, a V-groove is created. In this case, thebottom 39 of the V-groove is formed by a line, or, seen in thiscross-section, by a point, and thereby clearly is less wide than onefifth of the width B1 of the opening of the V-groove at the uppersurface or the decorative side 17 of the coupled panels, and also isless wide than the depth D1 of the V-groove.

In the example of the FIGS. 1 to 5, such chamfer 38 is provided on alledges 2-3-4-5 of the rectangular and oblong floor panel 1. According tovariants, such chamfer 38, for example, can be omitted on the short pairof edges 4-5. It is also noted that in FIG. 3 in dashed line a chamfer38A is represented, which extends to below the global level N2 of thecarrier 11, whereas the chamfer 38 represented in solid line indeedextends to below the global level N1 of the print 9, however, not tobelow the global level N2 of the carrier.

FIG. 5 represents that such chamfer 38 can be provided with a separatedecorative layer 40, for example, with a lacquer layer or transfer printlayer. Underneath the deepest point or the bottom 39 of the respectivechamfers 38 of the coupled panels 1, a contact surface 41 is created onthe back layers 8. Preferably, herein at the location of the contactsurface 41 a compression of the material of the back layer 8 will takeplace. The contact surface 41 is active in the locking in saidhorizontal direction H1. In the examples, a, seen in cross-section,closed chamber or cavity 42 is situated underneath this contact surface.

The examples of chamfers 38-38A listed up herein above are realized bymeans of the first possibility thereof mentioned in the introduction.

FIG. 7 represents a possibility for realizing a chamfer 38, wherein inthis case the second possibility mentioned introduction is applied. Therespective chamfer is formed by locally pressing down the top layer 7 atthe respective edge 5. Herein, a pressing element 43, in this case arolling element 43, is applied, which possibly can be heated. It is alsopossible to heat up the transparent thermoplastic layer 10 prior topressing down, for example, by means of an infrared beam device, whereinthen possibly use can be made of a press element 43 which is onlyslightly heated, for example, to maximum 40° C. or 35° C., with anunheated one, thus, on room temperature, or with one which is cooleddown below room temperature, for example, maximum to 15° C. Inconnection with FIG. 7, it is also noted that the pressing down in thiscase also results in a local compression of the substrate 6. Instead ofthe substrate 6 or in combination therewith, also the possible backlayer 8, which is not represented here, can be compressed locally.

FIGS. 8 and 9 also represent an example of said second possibility forrealizing a chamfer 38. In order to facilitate the pressing down, inthis case the substrate 6 is provided with an incision 44, which atleast partially offers room for the pressed-down material part. Ofcourse, glue 45 can be provided in the incision in order to minimize orprevent the springing back of the pressed-down upper edges 30. It ispossible that the lateral edge 46 of the chamfer 38 has to bepost-treated in order to obtain a good adjoining of the floor panels 1,for example, by providing a lateral edge 46A extending perpendicular tothe global decorative side 17, such as represented by the dashed line,for example, by means of a cutting treatment.

FIG. 10 represents another example of the aforementioned secondpossibility for realizing a chamfer 38. What is represented is a largerboard of substrate material comprising at least the substrates 6 of twofloor panels 1. These floor panels 1 are obtained, amongst others, bysubdividing from the larger board. Herein, an amount 47 of material willbe lost, situated between the finally realized profiled edges 4-5 of therespective floor panels 1. In order to facilitate the pressing down, thesubstrate 6 is pre-formed. To this aim, at the height of the chamfers 38to be provided, a recess 48 or impression is provided in the finaldecorative side 17, here represented in dashed line. The composinglayers 9-10-11 of the top layer 7 are connected with the pre-formedsubstrate 6 via an adhesive layer 49, for example, a polyurethanedispersion glue. Prior to gluing, the composing layers 9-10-11 mutuallyalready can be adhered to each other, for example, melded or otherwiselaminated. Of course, it is also possible that the composing layerscomprise a back layer 8, however, this is not represented here. Forobtaining a good pressing-on of the composing layers 9-10-11 on thesubstrate 6, it is possible to work, such as here, with a press element50, which comprises protrusions 51 corresponding to the recesses 48.Such press element 50 can also be applied without pre-deforming thesubstrate 6, wherein then during pressing possibly a compression of thesubstrate material can be obtained.

In the examples of FIGS. 7 to 10, it is respectively obtained that theprint 9 extends uninterruptedly from on the surface or the decorativeside 17 of the floor panel 1 over the entire or approximately the entiresurface of the chamfer 38.

The possible superficial lacquer layer, for example, a UV-hardeninglacquer layer, can be provided and/or hardened on the floor panel beforeor after realizing the chamfer 38, according to which possibility thischamfer 38 then also is realized. For example, in the case of the secondpossibility, it can be advantageous to provide and/or harden the lacquerlayer only after realizing the chamfer 38. Namely, a hardened lacquerlayer might burst when being pressed down together with the transparentthermoplastic layer 10.

FIG. 11 represents other floor panels with a chamfer 38 similar to thatof FIG. 5, but which is made curved and globally extends according to anangle A of approximately 40° with the panel surface or the decorativeside 17.

FIG. 12 represents other floor panels with a chamfer 38, wherein thesefloor panels 1 in coupled condition show a V-groove formed by thechamfers 38, and wherein the bottom 39 of this V-groove shows a width B2which is smaller than one third of the width B1 of the opening of theV-groove at the decorative side 17 of the coupled floor panels 1.

FIG. 13 represents an example, wherein also measures have been taken forobtaining an increased resistance against moisture or moisturepenetration in the substrate 6. In this case, use is made of a coveringlayer 27 on the basis of a water-repellent substance. The covering 27initially can be formed on an incompletely performed profile 26 of theedge portion. In this case, the final upper edge 30 of the respectiveedge region still is to be formed by cutting the final lateral surface28 of the top layer 7 according to the dashed line 52 and by forming thesurface of the chamfer 38 in order to remove in this manner an excessmaterial portion 53 from this top layer 7. FIG. 14 shows the obtainedresult, wherein the floor panel 1 is provided with a chamfer 38 on therespective edge.

FIG. 13 clearly shows that the covering layer 27 in this case initially,thus, prior to performing the cutting treatment which forms the chamfer,extends at least from on the substrate 6 onto the lateral surface 29 ofthe top layer 7. By the cutting treatment, which has to be performedsubsequently, for forming the chamfer, an excess portion of thiscovering layer 27 is removed. It is noted that the edge of the top layer7 extends distally over the surface of the chamfer. Thereby, the toplayer 7 forms a barrier against possible soiling of the surface ordecorative side 17, and it is possible to achieve a smoother productionof such floor panels 1.

It is evident that at the opposite edge 4 of the edge 3 represented inFIGS. 13 and 14, preferably a similar treatment is performed, however,with this difference that this opposite edge 4 preferably comprises thecomplementary coupling means 18, in this case, a coupling means in theform of a tongue.

Further, it is clear that in FIGS. 13 and 14 the first possibility forforming the chamfer 38 is applied.

FIGS. 7 to 10 and 15 further illustrate a third independent aspect ofthe invention. According to this third aspect, the invention alsorelates to a floor panel 1 with a thermoplastic top layer 7, whereinthis floor panel 1 comprises a substrate 6 and a top layer 7 provided onthis substrate 6, wherein the top layer 7 is at least composed of aprint 9 and a transparent thermoplastic layer 10 situated above saidprint 9, with the characteristic that said print 9 globally extends in ahorizontal level N1, however, comprises parts which extend below saidlevel N1. In the case of the FIGS. 7 to 10, this relates at least toparts of the print 9 on the surface of the chamfer 38, which extendbelow the level N1. In the case of FIG. 15, the floor panel 1 alsocomprises portions extending below the level N1 in the internal part ofthe decorative side 17. These portions may relate to imitations ofremoved material parts, such as it may be the case when imitatingscraping traces in wooden floor panels, or imitations of joints, cracksor gaps, or imitations of wood knots or other strongly pronounced reliefof wood and/or stone. It is clear that such floor panel 1 offers newpossibilities for imitating strongly structured floors. The thirdaspect, for example, allows still forming deep structures with panels ofwhich the transparent thermoplastic layer 10 has a limited thickness T2,for example, a thickness of less than 1 millimeter, or even of less than0.5 or less than 0.3 millimeters. As already mentioned, it isadvantageous to limit the thickness T2 of the transparent thermoplasticlayer 10.

According to preferred embodiments of the third aspect, the motif or theprint 9 can also extend to below the global level N2 of the lower sideof the possible carrier 11 of the print 9 and/or into the substrate 6and/or an underlying back layer. To this aim, the back layer 8 and/orthe substrate 6 may or may not be pre-formed. Possibly, a compression ofthe material of this back layer 8 and/or substrate 6 takes place there,where the print extends at least to below the global level N1 and/or N2.

There, where a global level is mentioned, respectively the horizontallevel is meant, wherein the sum of the square deviations of the actuallevel of the respective layer in the floor panel is minimal in respectto this horizontal level. In other words, this relates to the smallestsquare horizontal area best approaching the respective layer.

In FIG. 15, the top layer 7 is represented schematically as a singlelayer. However, it is clear that the top layer 7 preferably is composedof several layers, such as at least of a carrier sheet 11, a print 9 anda transparent thermoplastic layer 10.

It is clear that the third aspect can be combined with the first aspectand/or the second aspect of the invention or the preferred embodimentsthereof. According to the second and third aspect, it is not necessary,however, also not excluded to apply a chamfer 38, whether or notaccording to the first aspect. However, this second and third aspect infact can adopt one or more of the other characteristics mentioned withinthe scope of the first aspect, such as, for example, the characteristicsof the coupling means, locking parts, top layers or the like mentionedthere.

FIG. 16 represents an example of a floor panel 1 having thecharacteristics of the second aspect of the present invention mentionedin the introduction. Herein, this relates to a rectangular and oblongfloor panel 1. FIG. 17 represents that this floor panel 1 comprises asubstrate 6 and a top layer 7 provided on this substrate 6. As a toplayer 7, the top layers 7 mentioned in connection with the first aspectcan be applied, namely top layers 7 having at least a print 9 and atransparent thermoplastic layer 10 situated above said print 9. Forsimplicity's sake, in FIGS. 16 through 20 the top layer 7 is representedas a single layer. The particularity of the floor panel of FIG. 16 isthat it has a length L of more than 180 centimeters. The print 9represents a wood pattern, the pores of which extend globally in thelongitudinal direction of the floor panel 1.

FIG. 17 represents that the floor panel 1 further comprises means forrestricting the bending-through by its own weight. To this aim, thefloor panel 1 comprises an embedded profile 53, for example, a profilewhich is based on synthetic material or metal and preferably isextruded. In the case of synthetic material, glass fibers or otherfiller materials can be applied in the material in order to obtain ahigher bending strength. In this case, the embedded profile 53 relatesto an I-profile. Of course, other profiles can also be applied.Preferably, profiles are striven for which have a largest-possiblemoment of inertia when bending. The embedded profile 53 globally extendsin the longitudinal direction of the floor panel 1 and in this case islocated closer to the long edge 2 with the profile of the tongue 20 thanto the opposite long edge 3 with the profile of the groove 21. It is notexcluded that the embedded profile 53 globally might extend according tothe diagonal of the floor panel 1.

FIG. 18 represents that the embedded profile 53 in that case is situatedintegrally internally within the substrate 6. However, it is notexcluded that the profile 53, on one or more long or short edges, mightextend into the profile 26, where it then preferably also has the sameprofile 26 as the remaining parts of the respective edge.

FIG. 19 represents a variant, wherein instead of an embedded profile 53,at least one glass fiber mat or glass fabric layer 54 embedded in thesubstrate 6 is used, which is situated outside of the center line of thesubstrate 6, or outside of the neutral fiber, when bending the floorpanel 1. In this case, the glass fabric layer 54 is situated closer tothe decorative side 17 than to the lower side of the substrate 6. Ofcourse, a plurality of such glass fiber-containing layers can beapplied, and possibly they may be situated on both sides of the centerline of the substrate. According to the invention, such reinforcinglayer does not necessarily have to be embedded in the substrate 6 butmay also be located in the top layer, for example, underneath the print9, or in the underlying layer 12.

FIG. 20 represents a variant, wherein at least one layer 55 of the floorpanel 1 has a density of more than 650 kilograms per cubic meter. Inthis case, between the top layer 7 and the substrate 6, in this case ofsoft PVC, a HDF board having a thickness of 3 millimeters or more and adensity of at least 1000 kilograms per cubic meter is applied. Insteadof using a wood-based board material, also hard PVC or other hardsynthetic material can be used.

In FIGS. 16 to 20, also the measure is applied that the floor panelshave a thickness of 5 millimeters or more. Preferably, the thickness islimited to a maximum of 7, 8 or 9 millimeters.

It is clear that the means restricting the bending can also be appliedin floor panels having a length of less than 180 centimeters, however,preferably of more than 110 centimeters. According to a deviatingvariant, the invention thus also relates to such floor panels. It isclear that such floor panel further also can show the preferredcharacteristics of the floor panels of the first, second and/or thirdaspect, with the difference that they have a length of less than 180centimeters.

The present invention is in no way limited to the herein above-describedembodiments; on the contrary, such panels may be realized according tovarious variants without leaving the scope of the present invention.Moreover, the panels, instead of as floor panels, also can be realizedas wall panels or ceiling panels or even as furniture panels.

The invention claimed is:
 1. A floor panel comprising: a substratedefining a thickness of 2 to 10 millimeters, and a top layer provided onthe substrate, the top layer including at least a print representing awood pattern and being provided on a PVC-based film, an underlying layersituated between the substrate and the print, and a transparentthermoplastic layer based on PVC and situated above the print, the floorpanel, at least on a long pair of two opposite edges, defining astraight or curved chamfer, such that when two of said floor panel arein an installed condition said chamfers form a V-shaped groove; whereinthe transparent thermoplastic layer has a thickness of 0.15 to 0.4millimeters and is substantially free from solid additives; wherein thechamfer extends below the global level of said print and through saidprint into the underlying layer; wherein said chamfer is provided with aseparate decorative layer comprising a lacquer layer or a transfer printlayer; wherein the floor panel has a rectangular and oblong shape;wherein a material of the substrate is composed of glued together woodparticles or MDF or HDF, the underlying layer includes a thermoplasticmaterial extending completely above a centerline of a thickness of thepanel; and wherein the underlying layer includes a PVC layer.
 2. Thefloor panel of claim 1, wherein, in an installed condition of two ofsuch floor panels, a contact surface is formed on the respectiveunderlying layers, wherein the contact surface extends underneath adeepest point or bottom of the respective chamfers.
 3. The floor panelof claim 2, wherein said underlying layers comprise a compressed part atthe location of the contact surface.
 4. The floor panel of claim 1,wherein the floor panel, at respective edges, includes mechanicalcoupling means for coupling two of such floor panels to each other, suchthat a locking is created in a vertical direction perpendicular to theplane of the coupled panels, as well as in a horizontal directionperpendicular to the coupled edges and in the plane of the panels. 5.The floor panel of claim 1, wherein said substrate, at least at one ofsaid edges, is waterproof.
 6. The floor panel of claim 1, wherein awidth of the panel is at least 8 cm.
 7. The floor panel of claim 1,wherein a length of the panel is at least 110 cm.
 8. The floor panel ofclaim 1, wherein at least one layer of the floor panel has a densitylarger than 650 kilograms per cubic meter.
 9. The floor panel of claim1, further comprising coupling parts in the form of a tongue and agroove are substantially provided by the material of the substrate. 10.The floor panel of claim 1, wherein the substrate has a thickness morethan half of the entire thickness of the floor panel.
 11. The floorpanel of claim 1, wherein a thickness of the underlying layer is morethan 45 percent of an overall thickness of the top layer.
 12. The floorpanel of claim 1, wherein the chamfer extends below the global level ofsaid print and into said substrate.
 13. The floor panel of claim 1,wherein the chamfer extends into the underlying layer and is situatedcompletely above the substrate.
 14. The floor panel of claim 1, whereinthe PVC layer of the underlying layer is a soft PVC layer that includesa plasticizer.
 15. The floor panel of claim 1, wherein the PVC layer ofthe underlying layer includes PVC and chalk.
 16. A floor panelcomprising: a substrate defining a thickness of 2 to 10 millimeters, anda top layer provided on the substrate, the top layer being composed ofat least a print representing a wood pattern and being provided on aPVC-based film, and a transparent thermoplastic layer based on PVC andsituated above the print, the floor panel, at least on a long pair oftwo opposite edges, defining a straight or curved chamfer, such thatwhen two of said floor panel are in an installed condition said chamfersform a V-shaped groove; wherein the chamfer extends below the globallevel of said print and through said print into an underlying layer orinto said substrate; wherein said chamfer is provided with a separatedecorative layer comprising a lacquer layer or a transfer print layer;wherein the floor panel has a rectangular and oblong shape; wherein thesubstrate is substantially made from a soft PVC including PVC with aplasticizer content, the panel including a glass fiber containing layerat a position under the print and embedded in the substrate material.17. The floor panel of claim 16, wherein the chamfer extends into thesubstrate and is situated completely above the glass fiber layer. 18.The floor panel of claim 16, wherein the transparent thermoplastic layerhas a thickness of 0.15 to 0.4 millimeters.
 19. The floor panel of claim16, wherein the transparent thermoplastic layer is substantially freefrom solid additives.
 20. The floor panel of claim 16, wherein the floorpanel, at respective edges, includes mechanical coupling means forcoupling two of such floor panels to each other, such that a locking iscreated in a vertical direction perpendicular to the plane of thecoupled panels, as well as in a horizontal direction perpendicular tothe coupled edges and in the plane of the panels.
 21. The floor panel ofclaim 16, wherein a width of the panel is at least 8 cm.
 22. The floorpanel of claim 16, wherein a length of the panel is at least 110 cm. 23.The floor panel of claim 16, wherein at least one layer of the floorpanel has a density larger than 650 kilograms per cubic meter.
 24. Thefloor panel of claim 16, further comprising coupling parts in the formof a tongue and a groove are substantially provided by the material ofthe substrate.
 25. The floor panel of claim 16, wherein the substratehas a thickness more than half of the entire thickness of the floorpanel.
 26. The floor panel of claim 16, wherein the floor panel, atrespective edges, includes mechanical coupling means for coupling two ofsuch floor panels to each other, and in a coupled condition a contactzone is formed above the glass fiber layer.
 27. The floor panel of claim26, wherein said contact zone creates a barrier against moisturepenetration of a coupled joint of the two of such floor panels.
 28. Thefloor panel of claim 16, wherein the chamfer has an angle of 35° to 55°with a top surface of the panel.
 29. A floor panel comprising: asubstrate defining a thickness of 2 to 10 millimeters, and a top layerprovided on the substrate, the top layer including at least a printrepresenting a wood pattern and being provided on a film, an underlyinglayer situated between the substrate and the print, and a transparentthermoplastic layer and situated above the print, the floor panel, atleast on a long pair of two opposite edges, defining a straight orcurved chamfer, such that when two of said floor panel are in aninstalled condition said chamfers form a V-shaped groove; wherein thetransparent thermoplastic layer has a thickness of 0.15 to 0.4millimeters and is substantially free from solid additives; wherein thechamfer extends below the global level of said print and through saidprint into the underlying layer or into said substrate; wherein saidchamfer is provided with a separate decorative layer comprising alacquer layer or a transfer print layer; wherein the floor panel has arectangular and oblong shape; wherein the substrate is substantiallymade from thermoplastic material selected from the list consisting ofhard polyvinylchloride, polyethylene, and polypropylene; and wherein theunderlying layer includes a PVC layer.